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Infineon Technologies CY7C1320KV18-250BZC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1320KV18-250BZC SRAM, 18Mbit, 250 MHz, DDR II, Obsolete

MPNCY7C1320KV18-250BZC
Obsolete

Infineon (Cypress) CY7C1320KV18-250BZC, Synchronous DDR II+ SRAM, 18Mbit (512K x 36), 250 MHz clock, Parallel interface, 1.7V–1.9V supply, 165-LBGA (13x15 mm FBGA), 0°C to 70°C commercial temperature.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1320KV18-250BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency250 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization512K x 36

Product details

18 Mbit DDR II+ SRAM at 250 MHz — what it is

The CY7C1320KV18-250BZC from Infineon (formerly Cypress) is a 18 Mbit synchronous SRAM using a DDR II+ (Double Data Rate) architecture, organized as 512K words by 36 bits. It clocks at 250 MHz, delivering two data transfers per clock cycle for an effective bandwidth of 18 Gbit/s on a 36-bit bus. This part targets high-throughput, low-latency applications such as network packet buffers, telecom line cards, and high-end test equipment where QDR-style read-write concurrency is not required but raw sequential bandwidth is.

The 250 MHz clock frequency is the core timing spec. Because this is a DDR II device, data is clocked on both edges, so the effective data rate is 500 MT/s per pin. With a 36-bit data bus, that yields a peak throughput of 18 Gbit/s (2.25 GB/s). That bandwidth matters when the memory is feeding a high-speed ASIC or FPGA that cannot stall on read data. The trade-off: tighter PCB layout rules for signal integrity at these edge rates — the 165-ball FBGA helps keep trace lengths short.

The board must have a dedicated 1.8 V rail with tight regulation (within 100 mV). If your existing design runs on 2.5 V I/O, this part will not drop in without a level-shifter or a separate regulator. Check your power tree before committing the BOM line.

Housed in a 165-ball LBGA (13x15 mm FBGA), this is a fine-pitch BGA — ball pitch typical for this density. The footprint requires a multi-layer PCB with microvias or blind vias for fanout.

Lifecycle — officially obsolete

Infineon lists the CY7C1320KV18-250BZC as Obsolete. No last-time-buy window remains open through the manufacturer. For existing production, the only supply channel is the independent distribution market — new-old-stock or surplus inventory.