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Infineon Technologies CY7C1320BV18-200BZC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1320BV18-200BZC DDR II SRAM, 18Mbit, 200 MHz

MPNCY7C1320BV18-200BZC
Obsolete

Infineon (Cypress) CY7C1320BV18-200BZC, Synchronous DDR II SRAM, 18 Mbit organized 512K x 36, 200 MHz clock, 1.7V-1.9V supply, 165-FBGA, 0°C to 70°C.

$30.9300Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY7C1320BV18-200BZC Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Frequency200 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, DDR II
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization512K x 36

Product details

What this DDR-II SRAM is and where it fits

The Infineon CY7C1320BV18-200BZC is a synchronous DDR-II SRAM — 18 Mbit of fast, volatile memory organized as 512K words of 36 bits each, clocked at 200 MHz. The 36-bit word width is the notable feature here: it matches the data bus width of many networking processors and FPGAs without needing external byte-lane muxing, so it fits directly into high-bandwidth buffer applications like packet buffers, lookup tables, and DSP coefficient storage. The 1.7 V to 1.9 V supply range and 165-ball FBGA package (13x15 mm) place it in the low-voltage, fine-pitch BGA class — a board designed for this part needs controlled-impedance routing and proper BGA assembly reflow.

Obsolete — sourcing reality

Temperature grade and environment

Rated for 0°C to 70°C ambient — commercial temperature grade. That limits this part to indoor, climate-controlled equipment: servers, telecom central-office line cards, test equipment, and similar environments where the ambient stays within an office or data-center range. Not rated for industrial enclosures, outdoor cabinets, or under-hood automotive use.

Frequently asked questions

Where can I buy CY7C1320BV18-200BZC?

We source and quote this obsolete part to order against an RFQ through independent distribution. Current pricing and availability are confirmed at quote time — submit an RFQ for a firm position.

What is the closest pin-compatible alternative to CY7C1320BV18-200BZC?

No official pin-compatible successor or second-source alternate is documented in the available records for this exact order code. For a new design, evaluate current-generation DDR-II+ or QDR-II SRAM families from Infineon or other vendors, but verify the footprint and electrical interface against your board.

What is the package type for CY7C1320BV18-200BZC?

It ships in a 165-ball FBGA (13x15 mm) package, supplied in Tray format. The mounting is surface-mount only — not a hand-solderable package.

What is the memory organization of CY7C1320BV18-200BZC?

The memory is organized as 512K words by 36 bits, totaling 18 Mbit. The 36-bit word width is wider than the common x8 or x16 SRAM, which is the key feature for wide-bus applications.