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Infineon Technologies CY7C1319CV18-250BZC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1319CV18-250BZC 18Mbit DDR II SRAM, 250 MHz, 165-FBGA

MPNCY7C1319CV18-250BZC
Obsolete

Cypress CY7C1319CV18-250BZC, DDR II synchronous SRAM, 18 Mbit (1M x 18), 250 MHz clock frequency, parallel interface, 1.7V–1.9V supply, 0°C to 70°C, 165-ball FBGA (13x15 mm), Tray.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1319CV18-250BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency250 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 18

Product details

250 MHz DDR II SRAM — what the clock rate buys you

The CY7C1319CV18-250BZC is a Cypress 18 Mbit synchronous SRAM with a DDR II (double data rate) interface clocked at 250 MHz. That means data transfers on both edges of the clock, giving an effective 500 million transfers per second across the 18-bit-wide bus. For a system architect, this part sits in high-throughput data buffers — think network switch packet memory, test equipment acquisition buffers, or baseband processing where the bus can't stall for a dead cycle. The 1M x 18 organization is a natural fit when you need a parity or ECC bit alongside each 16-bit word without adding a second chip. The supply voltage range of 1.7V to 1.9V is tighter than a standard 3.3V SRAM — this is a low-voltage DDR-II core, so the board needs a dedicated 1.8V rail with good regulation. Don't expect to drop it onto a legacy 3.3V memory bus without a level translator and a separate supply. That confines it to indoor, climate-controlled equipment — server rooms, telecom central offices, benchtop instruments. No go for outdoor base stations or automotive cabin modules without a temperature-grade upgrade to a different part.

Package reality — 165-ball FBGA is not a field swap

The package is a 165-ball FBGA, 13x15 mm body. That is a fine-pitch BGA — no hand-soldering, no field replacement with a standard iron. If you are a field-service tech reading this: this chip stays on the board; you swap the whole assembly. For the rework lab, the profile needs a preheat soak to avoid cold joints on the inner balls, and the 0.8 mm pitch means the stencil aperture and pad diameter have to be dialed in.

The CY7C1319CV18-250BZC is officially marked obsolete. That means Cypress (now part of Infineon) has stopped manufacturing this exact order code. The only path to fill a BOM line is through independent distribution — surplus stock, new-old-stock, or broker inventory. If you have an active design using this SRAM, now is the time to qualify a pin-compatible alternative or plan a board respin.

Frequently asked questions

Is CY7C1319CV18-250BZC obsolete?

Yes, the CY7C1319CV18-250BZC is listed as obsolete. Cypress/Infineon no longer manufactures this part.

What is the replacement for CY7C1319CV18-250BZC?

The CY7C1319CV18-250BZC is an obsolete DDR II SRAM with a specific 1Mx18 organization, 250 MHz clock, and 165-ball FBGA package. A pin-compatible alternative would need to match the 1.7V–1.9V supply, DDR II interface, and 165-FBGA footprint. Without an official cross-reference, any substitution requires validating the footprint, timing, and supply voltage against the original design.

Where can I buy CY7C1319CV18-250BZC?

This obsolete part is not available from the original manufacturer. Submit an RFQ for a current market check.