QDR II SRAM at 300 MHz — what the clock buys the design
Its 300 MHz clock rate delivers back-to-back read and write transactions on separate data ports without dead cycles, a defining advantage over standard synchronous SRAMs that share a single bus. This architecture suits high-throughput buffering in network switches, telecom line cards, and test equipment where sustained bandwidth matters more than latency.
Buyers filling a BOM line for this order code will find it through independent distribution on a surplus or last-time-buy basis. If the application can tolerate a footprint or interface change, a current-production QDR II+ or QDR IV SRAM from Infineon (such as the CY7C1318KV18 series) may serve as a functional alternative, but pin-compatibility is not guaranteed — verify the ball map against the 165-FBGA layout before committing a board spin.
The 165-ball FBGA measures 13x15 mm with a 1.0 mm ball pitch typical of this density class. For rework, the full-array BGA demands a preheat profile that brings the entire package to 150°C before the reflow spike — local hot-air on a 13x15 mm body risks cold joints on the inner balls.