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Infineon Technologies CY7C1315KV18-250BZC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1315KV18-250BZC QDR II SRAM, 18 Mbit, 250 MHz, 165-FBGA

MPNCY7C1315KV18-250BZC
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Infineon Technologies CY7C1315KV18-250BZC QDR II synchronous SRAM, 18 Mbit (512K x 36), 250 MHz clock, parallel interface, 1.7 V–1.9 V supply, 0°C to 70°C, 165-ball FBGA (13x15 mm), tray.

$11.7100Ref. price · indicative, final on quote
Packaging165-LBGA
RoHSRoHS non-compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1315KV18-250BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency250 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization512K x 36

Product details

QDR II SRAM for high-throughput line cards

The CY7C1315KV18-250BZC is a 18 Mbit Quad Data Rate (QDR) II synchronous SRAM from Infineon Technologies, organized as 512K words by 36 bits. The QDR II architecture delivers two read and two write data words per clock cycle at the 250 MHz clock rate, effectively quadrupling the data throughput compared to a conventional single-data-rate SRAM running at the same frequency. This makes it a fit for high-bandwidth, low-latency applications such as network switch buffers, telecom line-card look-up tables, and traffic-manager memory where the bus must keep up with line-rate packet processing.

Supply rail and temperature grade

The core supply range is 1.7 V to 1.9 V, so a dedicated 1.8 V rail is the typical choice — the part does not share a 3.3 V plane. The operating temperature range is 0°C to 70°C, which limits deployment to indoor, temperature-controlled equipment; it is not rated for industrial or automotive ambient extremes. The 165-ball FBGA package (13x15 mm body) requires a multi-layer PCB with controlled-impedance traces for the high-speed parallel bus. Tray packaging means the parts are delivered in anti-static trays, not tape-and-reel — confirm your pick-and-place feeder setup accepts trays before committing to a volume order.

Lifecycle and compliance note

However, the part is RoHS non-compliant, meaning the solder balls are tin-lead (eutectic or high-lead) rather than lead-free. This is a legacy RoHS exemption part; your assembly house must accept tin-lead BGA processing, and the finished product may need a RoHS exemption claim if sold into regulated markets. No official successor or second-source cross-reference is listed on the record.

Sourcing and availability

The CY7C1315KV18-250BZC is sourced through authorized and independent distribution channels. No stock-holding claim is made on this page; the part is quoted to order per RFQ.

Frequently asked questions

What is the closest higher-performance sibling to CY7C1315KV18-250BZC in the same QDR II family?

The CY7C1415KV18-300BZXC is a 36 Mbit (1M x 36) QDR II SRAM running at 300 MHz in the same 1.7 V–1.9 V supply range and 165-ball FBGA package. It doubles the density and increases the clock rate by 50 MHz, making it a direct drop-in upgrade for designs needing more memory depth or higher throughput, provided the PCB layout and timing closure support the faster edge rates.

What compliance documentation does Infineon provide for CY7C1315KV18-250BZC?

The part is RoHS non-compliant — Infineon's documentation typically includes a material declaration and a statement of non-compliance for tin-lead BGA products. No UL, IEC, or REACH certificate is listed on the record for this specific order code.