Memory density and bandwidth ceiling
The CY7C1315BV18-200BZI is an 18 Mbit QDR II synchronous SRAM organized as 512K x 36, clocked at 200 MHz. The 36-bit data bus at double data rate delivers a theoretical peak bandwidth of 14.4 Gbit/s — the limiting factor in a high-throughput FIFO or packet buffer application is the controller's ability to sustain back-to-back reads and writes without bus turnaround penalties. The parallel memory interface uses separate read and write ports, eliminating the dead cycle between read-to-write transitions that single-port SRAMs incur. This matters for network switch buffers and radar signal processors where every clock cycle carries payload data.
Temperature grade and supply rail
The 1.7V–1.9V supply rail aligns with the 1.8V core voltage common in high-performance FPGAs and ASICs, so the SRAM can share the same power rail without an extra regulator. The 165-FBGA package (13x15 mm) uses a 1.0 mm ball pitch — hand-soldering is impractical; a reflow profile with a peak temperature of 245°C and a pre-bake at 125°C for 8 hours if the moisture sensitivity level exceeds MSL 3 is the standard assembly practice. The footprint requires a 4-layer PCB minimum for signal fan-out.
Obsolete lifecycle — sourcing route
A board spin is required to migrate to a different package or memory family.