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Infineon Technologies CY7C1270XV18-600BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1270XV18-600BZXC Infineon 36Mbit DDR II SRAM, 600 MHz

MPNCY7C1270XV18-600BZXC
Obsolete

Infineon Technologies CY7C1270XV18-600BZXC DDR II synchronous SRAM, 36Mbit (1M x 36), 600 MHz clock, 1.7V-1.9V supply, 165-FBGA (13x15), tray.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1270XV18-600BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency600 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 36

Product details

Obsolete — the procurement reality for this 600 MHz DDR II SRAM

The CY7C1270XV18-600BZXC: The 600 MHz clock rate and 36Mbit (1M x 36) organization place this in the high-bandwidth synchronous SRAM class, typically used in network buffers, test equipment, or high-speed data acquisition where the parallel interface and DDR II throughput are fixed in the BOM. Sourcing this part today means working through independent distribution — surplus or last-time-buy inventory, with date-code provenance and lot traceability confirmed at RFQ.

600 MHz clock, 1.7V-1.9V supply, 165-FBGA footprint

The 600 MHz clock frequency is the headline performance spec — the DDR II interface transfers data on both clock edges, so the effective data rate is 1.2 Gbps per pin. The 36-bit-wide data bus delivers a peak bandwidth of 43.2 Gbps. The 165-ball FBGA package (13x15 mm body) uses a 1.0 mm ball pitch typical of high-density SRAMs from this era. The mounting is surface-mount, and the tray packaging is the standard shipping medium for BGA devices — no tape-and-reel option is listed.

Frequently asked questions

What is the memory organization and clock speed of CY7C1270XV18-600BZXC?

It is a 36Mbit synchronous DDR II SRAM organized as 1M words x 36 bits, with a 600 MHz clock frequency. The parallel interface transfers data on both clock edges.

What package does CY7C1270XV18-600BZXC use?

It is supplied in a 165-ball FBGA (fine-pitch ball grid array) package with a 13x15 mm body. The mounting type is surface mount, and the shipping medium is tray.