Skip to main content
Infineon Technologies CY7C1262XV18-450BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1262XV18-450BZXC 36Mbit QDR II+ SRAM, 450 MHz

MPNCY7C1262XV18-450BZXC
Active

Infineon CY7C1262XV18-450BZXC, 36 Mbit QDR II+ synchronous SRAM, 2M × 18 organization, 450 MHz clock, 1.7–1.9 V supply, 165-LBGA surface-mount package, 0–70 °C rated.

$108.3800Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY7C1262XV18-450BZXC Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Frequency450 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageBulk
TechnologySRAM - Synchronous, QDR II+
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 18

Product details

36 Mbit QDR II+ SRAM at 450 MHz — what it means for the bus

The Infineon CY7C1262XV18-450BZXC is a 36 Mbit synchronous SRAM built on the QDR II+ architecture, organized as 2M × 18. The 450 MHz clock rate gives the bus a read-write turnaround with no dead cycles — the QDR II+ interface eliminates the idle cycle between read and write that conventional SRAMs require. That matters for high-throughput packet buffers in network switches, line cards, and telecom line-rate processing where every clock edge carries a data transfer.

Supply and temperature — fit for controlled environments

The part operates from a 1.7 V to 1.9 V core supply, which aligns with the lower-voltage I/O of modern ASICs and FPGAs. The 0 °C to 70 °C commercial temperature range restricts it to indoor, climate-controlled equipment — server rooms, central offices, and lab-grade instrumentation. For an outdoor or industrial bay, you would need the extended-temperature variant of this family.

Package and footprint — 165-FBGA (13x15 mm)

The 165-ball FBGA package (13x15 mm body) is a fine-pitch BGA that requires a multi-layer PCB with microvias or blind vias for fanout. The footprint matches the standard QDR II+ SRAM layout used across the CY7C1262 family, so a board laid out for a slower speed grade can accept this 450 MHz part with no PCB change — just a BOM swap.

Frequently asked questions

Is CY7C1262XV18-450BZXC obsolete or nearing end of life?

The lifecycle stage is marked EOL hot, indicating end-of-life is in progress. The official product status is still listed as Active, but the EOL hot flag means last-time-buy windows are active or closing. No official replacement part number is recorded.

What is the datasheet for CY7C1262XV18-450BZXC?

The datasheet covers the CY7C1262 family of QDR II+ synchronous SRAMs. The base product number is CY7C1262. The datasheet includes timing diagrams, AC characteristics at 450 MHz, and the 165-FBGA package drawing.