Skip to main content
Infineon Technologies CY7C1069AV33-12ZXCT — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1069AV33-12ZXCT 16 Mbit Async SRAM, 12 ns

MPNCY7C1069AV33-12ZXCT
Obsolete

Infineon CY7C1069AV33-12ZXCT, 16 Mbit asynchronous SRAM, 12 ns access time, 3.3 V supply, 2M x 8 organization, parallel interface, 54-TSOP II package, 0 to 70 °C commercial temperature, Tape & Reel.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1069AV33-12ZXCT specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage3V ~ 3.6V
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTape & Reel (TR)
TechnologySRAM - Asynchronous
Access time12 ns
Memory size16Mbit
Memory formatSRAM
Case54-TSOP (0.400\", 10.16mm Width)
Memory organization2M x 8
Write cycle time - word, page12ns

Product details

The Infineon CY7C1069AV33-12ZXCT is a 16 Mbit asynchronous SRAM organized as 2M x 8, with a 12 ns access time that sets the timing budget for the processor-to-memory interface. The 12 ns write cycle time matches the read access, so back-to-back reads and writes run at the same speed without dead cycles.

2M x 8 organization — byte-wide memory for 8-bit or muxed buses

Organized as 2M words of 8 bits each, this SRAM connects directly to an 8-bit data bus. In a 16-bit or 32-bit system, you need two or four devices with the address lines shared and the chip selects decoded — or external byte-lane muxing. The parallel interface is straightforward: address, data, chip enable, output enable, and write enable. No clock, no burst logic, no refresh cycles — the asynchronous nature simplifies timing closure but means every access takes the full 12 ns cycle.

Infineon lists the CY7C1069AV33-12ZXCT as obsolete. For BOM lines that still require this part, procurement must turn to independent distribution and surplus channels. The 54-TSOP II footprint is shared across many asynchronous SRAMs in the 16 Mbit density range, but pin compatibility with any specific alternate needs to be verified against the target system's timing and supply requirements.

54-TSOP II — footprint and rework

Housed in a 54-TSOP II (0.400 inch body width, 10.16 mm), this is a fine-pitch surface-mount package. The Tape & Reel shipping form indicates it was intended for high-volume pick-and-place. For rework, the typical hot-air profile for TSOP packages applies — preheat the board to 125 °C, then focus the nozzle on the package body until the solder reflows. Inspect for bridges under magnification; the 0.5 mm lead pitch leaves little room for error.

Frequently asked questions

Is CY7C1069AV33-12ZXCT obsolete?

Yes, Infineon lists the CY7C1069AV33-12ZXCT as obsolete. Procurement must rely on surplus and broker channels for this part.

What is the exact replacement for CY7C1069AV33-12ZXCT?

Infineon has not published a direct replacement order code for this specific obsolete variant.