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Infineon Technologies CY7C1061DV33-10BVJXIT — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1061DV33-10BVJXIT 16Mbit Async SRAM, 10 ns

MPNCY7C1061DV33-10BVJXIT
Obsolete

Infineon CY7C1061DV33-10BVJXIT, 16Mbit asynchronous SRAM, 1M x 16 organization, 10 ns access time, 3V to 3.6V supply, -40°C to 85°C industrial temperature, 48-VFBGA package.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1061DV33-10BVJXIT specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage3V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR)
TechnologySRAM - Asynchronous
Access time10 ns
Memory size16Mbit
Memory formatSRAM
Case48-VFBGA
Memory organization1M x 16
Write cycle time - word, page10ns

Product details

The CY7C1061DV33-10BVJXIT: This class of fast, wide-bus SRAM is typically used as a data buffer, cache tag store, or frame buffer in networking equipment, industrial controllers, test instrumentation, and telecom line cards where deterministic access latency matters more than density.

10 ns access time — the bus timing decision

The 10 ns access time and 10 ns write cycle time keep the bus symmetric for 16-bit wide reads and writes.

That means new-manufacture units are no longer available through the factory channel. If this SRAM is on your BOM, securing stock for production runs or spares requires a qualified distributor who can source from the open market and verify authenticity.

The 48-VFBGA (8x9.5 mm) is a fine-pitch ball-grid array. This is not a hand-solderable package — it needs a reflow oven or hot-air station with a profile tuned for the 0.5 mm or 0.65 mm ball pitch typical of VFBGA. The small body and low ball count make it less thermally challenging than a large BGA, but the balls are hidden under the package, so X-ray inspection is the only way to confirm solder joint integrity after reflow. Orientation is marked by the usual corner ball or silkscreen dot; confirm pin 1 location on the board layout before placing the part. If your assembly line is not set up for BGA rework, this package adds cost and risk versus a TSOP or SOJ alternative.

Frequently asked questions

Is CY7C1061DV33-10BVJXIT obsolete?

Engineers and buyers need to know lifecycle status to plan redesigns or secure last-time buys.

What is the replacement for CY7C1061DV33-10BVJXIT?

Sourcing buyers and brokers need a drop-in equivalent or recommended successor to avoid redesign.

Where can I buy CY7C1061DV33-10BVJXIT in stock?

Transactional buyers need immediate stock availability, especially for obsolete parts with limited supply.

What is the price of CY7C1061DV33-10BVJXIT?

Commercial buyers require price for BOM costing and budget planning.

What is the pinout of CY7C1061DV33-10BVJXIT?

Design engineers need pin compatibility to validate fit in existing or new PCB layouts.