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Infineon Technologies CY7C1061AV33-10ZXI — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1061AV33-10ZXI 16Mbit Async SRAM, 10 ns

MPNCY7C1061AV33-10ZXI
Obsolete

Infineon CY7C1061AV33-10ZXI, asynchronous SRAM, 16 Mbit organized 1M x 16, 10 ns access time, parallel interface, 3V–3.6V supply, -40°C to 85°C, 54-TSOP II tray.

$37.9333Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY7C1061AV33-10ZXI Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage3V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C~85°C(TA)
PackageTray
TechnologySRAM - Asynchronous
Access time10 ns
Memory size16Mbit
Memory formatSRAM
Case54-TSOP (0.400\", 10.16mm Width)
Memory organization1M x 16
Write cycle time - word, page10ns

Product details

16 Mbit asynchronous SRAM — 10 ns access, industrial temp

The Infineon CY7C1061AV33-10ZXI is a 16 Mbit asynchronous SRAM organized as 1M x 16, with a 10 ns access time and a parallel interface. It operates from a 3V to 3.6V supply and is rated for -40°C to 85°C, making it suitable for industrial control, telecom infrastructure, and factory automation where the bus timing budget is tight and the environment sees extended temperature swings. The 54-TSOP II footprint is a standard surface-mount package for mid-density SRAMs, compatible with existing PCB layouts in that form factor.

Industrial temperature grade — deployment context

The -40°C to 85°C operating range covers outdoor telecom cabinets, unheated factory floors, and engine-bay-adjacent electronics. The 54-TSOP II package is a 0.400-inch-wide body, 10.16 mm, with a standard JEDEC footprint — rework with a hot-air station is straightforward, but the fine pitch means the PCB land pattern must match the supplier's recommended stencil aperture for reliable solder joints.

Obsolete — sourcing reality

Frequently asked questions

What is the package type for CY7C1061AV33-10ZXI?

It ships in a 54-TSOP II package (0.400" body width, 10.16 mm height) on tray.

What is the memory technology and organization?

It is an asynchronous SRAM with 16 Mbit capacity organized as 1M x 16 bits, using a parallel interface.