The CY7C1041CV33-15ZC is a 4 Mbit asynchronous SRAM from Infineon (formerly Cypress), organized as 256K x 16 bits. For a system architect, that 15 ns window determines whether the SRAM can keep pace with the processor bus without inserting wait states. If the bus clock period is 20 ns or wider, this part fits a zero-wait-state read; at faster clocks you need to budget the access time against the memory controller's setup and hold requirements.
Package and footprint — 44-TSOP II rework considerations
The part comes in a 44-TSOP II package (10.16 mm body width, 0.400 inch pitch). This is a surface-mount gull-wing lead form, common for mid-density SRAMs. For the rework lab, the TSOP II profile is straightforward with hot air — preheat the board to 125°C, use a fine nozzle, and lift the part when the solder on all leads is liquid. The package is MSL 3 per the Cypress standard for TSOPs, so if the moisture barrier bag has been open longer than the floor life, bake at 125°C for 48 hours before reflow.
This part is officially obsolete per the manufacturer. No last-time-buy window remains open. For the BOM, that means new production builds cannot source this through franchised distribution. The available stock is independent-distributor inventory — traceable, tested, but finite. The 44-TSOP II footprint is common across many 4 Mbit asynchronous SRAMs, but a pin-compatible drop-in is not guaranteed without checking the specific pinout and timing.
That limits this part to indoor, temperature-controlled environments.