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Infineon Technologies CY7C1041CV33-12BAXET — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1041CV33-12BAXET 4Mbit Async SRAM, 12 ns

MPNCY7C1041CV33-12BAXET
End of Life

Infineon Technologies CY7C1041CV33-12BAXET asynchronous SRAM, 4Mbit (256K x 16), 12 ns access time, 3V-3.6V supply, -40°C to +125°C, 48-TFBGA (7x8.5 mm), Tape & Reel.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1041CV33-12BAXET specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage3V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 125°C (TA)
PackageTape & Reel (TR)
TechnologySRAM - Asynchronous
Access time12 ns
Memory size4Mbit
Memory formatSRAM
Case48-TFBGA
Memory organization256K x 16
Write cycle time - word, page12ns

Product details

12 ns asynchronous SRAM in a 48-ball BGA

The CY7C1041CV33-12BAXET is a 4 Mbit asynchronous SRAM organized as 256K x 16 bits, with a 12 ns access time that sets the bus timing ceiling for the memory controller. The parallel interface means the address and data buses connect directly to a processor or FPGA without a serialization delay — the 12 ns cycle time keeps the read/write window tight enough for a 66 MHz bus with moderate trace lengths.

48-TFBGA footprint and board layout

Housed in a 48-ball TFBGA measuring 7 x 8.5 mm (supplier device package 48-FBGA), the ball pitch is 0.8 mm — a 4-layer board with microvias can fan out the inner rows without blind vias. The 0.8 mm pitch also means a standard BGA rework station with a 10 mm nozzle can handle it. The 256K x 16 organization uses 16 data lines and 18 address lines, so the PCB trace count is manageable for a mid-complexity memory bus.

Frequently asked questions

What is the memory organization and access time of the CY7C1041CV33-12BAXET?

The parallel interface connects directly to a 16-bit data bus.

What package does the CY7C1041CV33-12BAXET come in?

It is supplied in a 48-ball TFBGA (thin fine-pitch ball grid array) with a body size of 7 x 8.5 mm. The supplier device package is 48-FBGA. The tape-and-reel packaging is suitable for automated assembly.