For a 16-bit data bus running at 66 MHz or 100 MHz, this part keeps the memory pipeline full.
The 44-TSOP II package (0.400-inch body width, 10.16 mm) is a standard JEDEC thin small-outline profile with gull-wing leads on 0.8 mm pitch. It is surface-mount and reworkable with hot air if you have a fine nozzle and steady hands — the leads are exposed and easy to inspect. No thermal pad underneath, so the board copper does the heat spreading. The tray shipping medium is fine for low-volume assembly; for reel quantities you would need to transfer to tape.
For new designs, look at the broader 1 Mbit asynchronous SRAM market — parts like the ISSI IS61LV10248 or Alliance Memory AS7C34096 offer similar 64K x 16 organization and 10 ns access in comparable TSOP II packages, though pin compatibility should be verified against the datasheet.
