The CY7C1021B-15ZXET: The 44-TSOP II package (0.400-inch body, 10.16 mm width) is surface-mount, so no socket; you need a hot-air station or a reflow profile to swap it on site. The -40°C to +125°C operating range qualifies it for industrial and automotive-adjacent environments where the board sees thermal cycling — engine bay, outdoor telecom, or a hot enclosure. At 125°C junction, the standby current creeps up, but the 15 ns access holds across the band.
Obsolete — sourcing reality for the BOM line
Infineon lists this part as Obsolete. That means the only supply channel is independent surplus and broker inventory — no factory orders, no last-time-buy window. If this is on your BOM, the procurement move is to secure a lot against the remaining build run or qualify a replacement.
Package and board-fit — what the 44-TSOP II demands
The 44-TSOP II footprint is a standard JEDEC outline — 0.400-inch body width, 10.16 mm, with leads on 0.80 mm pitch. The supplier device package is the thin small-outline version (TSOP II), which sits lower than a standard TSOP and has a narrower body. The Tape & Reel delivery means it comes on a 13-inch reel for automated pick-and-place; the reel quantity is not stated, but typical for this package is around 1000 pieces per reel. The 15 ns access time means the address-to-data valid window is tight; trace length matching on the 16-bit data bus matters if the board runs at the rated speed.