CY7C1010DV33-10ZSXIT

Infineon Technologies

Infineon CY7C1010DV33-10ZSXIT asynchronous SRAM, 2Mbit (256K x 8), 10 ns access time, parallel interface, 3V to 3.6V supply, -40°C to 85°C, 44-TSOP II (0.400", 10.16mm width), surface mount.

Infineon Technologies CY7C1010DV33-10ZSXIT
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[IN STOCK] In Stock: 499 pcs
$6.51/ pc

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MOQ 1 · Tape & Reel (TR) Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

CY7C1010DV33-10ZSXIT specifications
Parameter / AttributeSpecification / Value
Memory typeVolatile
MountingSurface Mount
Supply voltage3V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR) Cut Tape (CT)
TechnologySRAM - Asynchronous
Access time10 ns
Memory size2Mbit
Memory formatSRAM
Case44-TSOP (0.400\", 10.16mm Width)
Memory organization256K x 8
Write cycle time - word, page10ns

Technical details

The Infineon CY7C1010DV33-10ZSXIT is a 2 Mbit asynchronous SRAM organized as 256K words by 8 bits. Its 10 ns access time means the part can keep up with fast 3.3 V processors without inserting wait states in many embedded designs — the data appears on the bus within 10 ns of the address being valid, which is tight enough for most 50–100 MHz bus cycles. The parallel interface is straightforward: no clock, no refresh overhead.

Infineon has designated the CY7C1010DV33-10ZSXIT as Last Buy. That means the manufacturer has issued a final purchase window — once that closes, no more factory orders. After the Last Buy date, supply shifts entirely to the independent channel: surplus inventory, distributor stock, and broker-sourced material. If your design can tolerate a footprint change, Infineon's current-production asynchronous SRAM family (same 44-TSOP II footprint, similar speed grades) is the natural successor path — but no direct pin-compatible replacement has been announced under the same base number.

Rework note: 44-TSOP II on a production board

The 44-TSOP II is a gull-wing leaded package with 0.8 mm pitch — reworkable by hand with a hot-air station and fine-tipped iron for touch-up. The plastic body is MSL 3 typical for this family, so if the moisture-barrier bag has been open longer than the floor-life window, bake the parts at 125°C for 24 hours before reflow to avoid popcorning. The wide body (10.16 mm) gives good thermal contact with the preheater; just watch that you don't overheat the adjacent passives when removing the part.

CY7C1010DV33-10ZSXIT
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