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Infineon Technologies CY62167DV30LL-55BVXI — Discrete Semiconductors
Infineon Technologies

CY62167DV30LL-55BVXI SRAM 16Mbit 55 ns MoBL

MPNCY62167DV30LL-55BVXI
End of Life

Infineon MoBL® CY62167DV30LL-55BVXI asynchronous SRAM, 16Mbit (1M x 16), 55 ns access time, 2.2V ~ 3.6V supply, -40°C ~ 85°C, 48-VFBGA (8x9.5 mm) surface mount.

$13.1Ref. price · indicative, final on quote
CY62167DV30LL-55BVXI datasheet
Packaging48-VFBGA
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY62167DV30LL-55BVXI Technical Specifications
ParameterValue
SeriesMoBL®
Memory typeVolatile
Mounting typeSurface Mount
Voltage2.2V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Asynchronous
Access time55 ns
Memory size16Mbit
Memory formatSRAM
Case48-VFBGA
Memory organization1M x 16
Write cycle time - word, page55ns

Product details

55 ns access time — bus timing margin for slower controllers

The 55 ns access time sets the window between address assertion and valid data on the bus. A faster sibling like the CY7C1061G30-10BVXI offers a 10 ns access time in the same density and package footprint.

Active lifecycle with no near-term obsolescence risk

The CY62167DV30LL-55BVXI carries an Active lifecycle status. No end-of-life notification or last-time-buy schedule has been issued. This makes it a safe choice for production BOMs where supply continuity over the next several years is required. The part is RoHS3 compliant.

Frequently asked questions

Can CY62167DV30LL-55BVXI replace CY62167DV30LL-55BVI?

The CY62167DV30LL-55BVXI and CY62167DV30LL-55BVI share the same base part number and key specs (16 Mbit, 55 ns, 2.2-3.6V, -40 to 85°C). The suffix difference indicates a package or revision variant. Verify the exact package code and footprint compatibility before substituting in a board design.