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Infineon Technologies CY62157DV30L-70BVXI — Logic ICs

CY62157DV30L-70BVXI Infineon MoBL SRAM, 8Mbit, 70ns

MPNCY62157DV30L-70BVXI
End of Life

Infineon MoBL series CY62157DV30L-70BVXI, 8Mbit asynchronous SRAM, 512K x 16 organization, 70 ns access time, 2.2V to 3.6V supply, -40°C to 85°C industrial temperature, 48-VFBGA (6x8 mm) package, ROHS3 compliant.

$3.07Ref. price · indicative, final on quote
Packaging48-VFBGA
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

CY62157DV30L-70BVXI Technical Specifications
ParameterValue
SeriesMoBL®
Memory typeVolatile
Mounting typeSurface Mount
Voltage2.2V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageBulk
TechnologySRAM - Asynchronous
Access time70 ns
Memory size8Mbit
Memory formatSRAM
Case48-VFBGA
Memory organization512K x 16
Write cycle time - word, page70ns

Product details

8 Mbit MoBL asynchronous SRAM for industrial buffer and cache

The Infineon CY62157DV30L-70BVXI is an 8 Mbit asynchronous SRAM from the MoBL (More Battery Life) series, organized as 512K words by 16 bits.

70 ns access — bus timing margin for 8/16-bit hosts

For a 16-bit MCU running at 20 MHz (50 ns cycle), this part requires at least one wait state unless the memory controller stretches the read cycle. It pairs cleanly with slower 8-bit hosts or CPLD-based memory controllers that insert one wait.

512K x 16 organization — direct 16-bit bus match

Organized 512K deep by 16 bits wide, this SRAM connects directly to a 16-bit data bus without byte-lane muxing. For 32-bit processors, two devices can be paired for a 32-bit word. The 8 Mbit density suits moderate-size buffers (e.g., 256 KB for display frame stores or communications packet buffers).

At 3.3 V the access time is guaranteed at 70 ns; at 2.5 V the part still meets the same timing, though the datasheet derating curve should be checked for marginal cases.

48-VFBGA footprint — layout considerations

The 48-ball VFBGA (6x8 mm body) uses a 0.75 mm ball pitch typical of fine-pitch BGAs. The PCB requires at least four layers for fanout, with microvias recommended for the inner balls. The bulk shipping form means parts arrive in anti-static tubes or trays, not tape-and-reel, which affects pick-and-place feeder setup.

Lifecycle and compliance

No successor or second-source part is recorded in the official cross-reference — if dual-sourcing is required, the CY7C1049G30-10VXIT (4 Mbit, 10 ns, same VFBGA footprint) is a faster but lower-density alternative, not a pin-for-pin drop-in.

Frequently asked questions

Is CY62157DV30L-70BVXI RoHS compliant?

Yes, it is ROHS3 compliant per Infineon's lifecycle record.