CY62148EV30LL-45BVXI

Infineon Technologies · MoBL® Series

Infineon MoBL® CY62148EV30LL-45BVXI, 4Mbit asynchronous SRAM, 512K x 8 organization, 45 ns access time, 2.2V to 3.6V supply, -40°C to 85°C, 36-VFBGA (6x8 mm), ROHS3 compliant.

Infineon Technologies CY62148EV30LL-45BVXI
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Technical specifications

CY62148EV30LL-45BVXI specifications
Parameter / AttributeSpecification / Value
SeriesMoBL®
Memory typeVolatile
MountingSurface Mount
Supply voltage2.2V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Asynchronous
Access time45 ns
Memory size4Mbit
Memory formatSRAM
Case36-VFBGA
Memory organization512K x 8
Write cycle time - word, page45ns

Technical details

4 Mbit asynchronous SRAM in a 36-ball VFBGA

The Infineon CY62148EV30LL-45BVXI is a 4 Mbit asynchronous SRAM from the MoBL® series, organized as 512K x 8 bits. The 36-ball VFBGA (6x8 mm) package keeps the footprint small, but the fine-pitch BGA demands careful PCB layout — route the address and data lines with matched trace lengths and place decoupling caps within 2 mm of each VDD ball.

45 ns access time — timing margin for slower buses

For a microcontroller or FPGA memory controller running at 20 MHz (50 ns cycle), this leaves only 5 ns of margin before setup — tight. If your bus runs at 16.67 MHz (60 ns cycle), you have 15 ns of margin, which is comfortable. If the controller is faster than 20 MHz, consider a 10 ns SRAM like the CY7C1041GN30-10BVXI instead.

The 2.2V to 3.6V supply range means it can run from a 3.3V rail (typical) or a 2.5V rail without a separate regulator — useful in dual-voltage systems where the core logic is 1.8V but the I/O bank is 3.3V.

Package and footprint — 36-VFBGA layout notes

The 36-ball VFBGA (6x8 mm) has a 0.5 mm ball pitch. That is fine enough that a standard 0.8 mm via between balls won't fit — use microvias or via-in-pad with filled and capped vias. The supplier device package is 36-VFBGA (6x8), so the footprint is the same across the MoBL family.

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