48-VFBGA footprint and supply flexibility
The CY62146EV30LL-45BVXI: Housed in a 48-VFBGA (6x8 mm) package, this SRAM mounts on the board surface with a fine-pitch BGA footprint — the 0.50 mm ball pitch demands a controlled solder-paste stencil and a reflow profile matching JEDEC J-STD-020 for the thin package body.
Industrial temperature grade and storage planning
The 45 ns write cycle time matches the read access — no wait-state penalty for mixed read/write sequences on a 16-bit bus at typical microcontroller clock rates. For the storeroom, the Tray packaging means the reels stay flat; store below 30°C and 60% RH per the VFBGA moisture sensitivity level (MSL 3 typical for this package family) to avoid pre-bake before assembly.