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Infineon Technologies CY2SSTV16859ZC — Logic ICs

CY2SSTV16859ZC Buffer, Non-Inverting, 64-TSSOP, 2.3V–2.7V

MPNCY2SSTV16859ZC
End of Life

Cypress CY2SSTV16859ZC, 13-element 26-bit non-inverting buffer, 2.3V–2.7V supply, 16mA output drive, 64-TFSOP/TSSOP, 0°C–85°C, active, RoHS non-compliant.

$0.77Ref. price · indicative, final on quote
Packaging64-TFSOP (0.240", 6.10mm Width)
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY2SSTV16859ZC Technical Specifications
ParameterValue
Logic typeBuffer, Non-Inverting
Mounting typeSurface Mount
Voltage2.3V ~ 2.7V
Current - output high, low16mA, 16mA
Operating temperature0°C ~ 85°C (TA)
PackageBulk
Case64-TFSOP (0.240\", 6.10mm Width)
Number of elements13
Number of bits per element26

Product details

13-element, 26-bit non-inverting buffer for SSTL-2 memory buses

The Cypress CY2SSTV16859ZC is a 13-element, 26-bit non-inverting buffer designed for DDR SDRAM memory bus termination and clock distribution. Each of the 13 elements handles 26 bits, giving a total of 338 bits of buffered signal path. The part operates from a 2.3V to 2.7V supply, matching the SSTL-2 (Stub Series Terminated Logic for 2.5V) standard used in DDR1 memory interfaces. Output drive is symmetric at 16mA high and low, sufficient for driving multiple DIMM loads on a heavily loaded memory bus.

Fine-pitch TSSOP — rework and layout notes

Housed in a 64-TFSOP (0.240", 6.10mm width) package, also specified as a 64-TSSOP supplier device package, this is a fine-pitch surface-mount part with 0.5mm lead pitch. The narrow body and dense pin count demand careful solder-paste stencil design and a reflow profile that avoids tombstoning. Under a hot-air station, the part lifts cleanly if you preheat the board to 100°C and work the leads from the long sides — the thermal mass is low, so it reflows fast. The package is MSL 3 per standard Cypress TSSOP handling — bake before reflow if the moisture-barrier bag has been open past the floor-life window.

It is not specified for industrial or automotive temperature extremes. If your application sees below-freezing startup or sustained heat above 85°C, look for an industrial-temperature variant in the same family.

RoHS non-compliant — legacy solder finish

The CY2SSTV16859ZC is listed as RoHS non-compliant, meaning the device uses a lead-bearing solder finish (likely SnPb). If your assembly line is RoHS-only, you will need to qualify a lead-free alternative or apply for an exemption.

Frequently asked questions

What is the datasheet for CY2SSTV16859ZC?

Buyers need to verify electrical and mechanical specifications before design-in or replacement.

Where can I buy CY2SSTV16859ZC?

Sourcing engineers require immediate purchase channels to avoid production delays.

Is CY2SSTV16859ZC in stock?

Stock availability directly impacts lead times and the ability to fulfill BOM requirements.

What is the price of CY2SSTV16859ZC?

Cost is a key factor for procurement decisions and budget planning.

What is the alternative to CY2SSTV16859ZC?

If the part is unavailable or obsolete, engineers need drop-in replacements or cross-references.

What is the operating temperature range of CY2SSTV16859ZC?

Temperature specs determine suitability for the target environment and reliability.