PLL-based zero delay buffer for clock distribution
The Cypress CY23S09ZC-1 is a PLL-based zero delay buffer clock driver that takes a single reference clock input and distributes it to nine outputs with minimal skew between channels. The integrated PLL (with bypass option) realigns the output edges to the input, making it suitable for synchronizing multiple clock loads in a PCB where trace delays would otherwise accumulate. It operates from a 3V to 3.6V supply and is rated for a maximum output frequency of 133.33 MHz.
1:9 fanout — consolidating the clock tree
With a 1:9 input-to-output ratio, this single buffer can drive up to nine clock loads from one reference source. That reduces the number of buffer stages needed in a distribution tree, saving board area and BOM line items compared to a 1:5 or 1:4 part where multiple devices would cascade. The outputs are single-ended (no differential pairs), which keeps the routing simple for LVCMOS or LVTTL clock lines on standard PCB layers.
Commercial temperature grade — indoor use only
The operating temperature range of 0°C to 70°C (ambient) limits this part to commercial, indoor, temperature-controlled environments — office equipment, consumer electronics, telecom central-office racks, and similar applications where the ambient stays within that band. It is not rated for industrial motor drives, outdoor telecom cabinets, or automotive under-hood environments where -40°C to +85°C or wider is required. If your design lives in a conditioned space, this grade is cost-effective; if it sees a cold start or hot roof, you need the industrial-temperature variant.
RoHS non-compliant — plan for exemptions
This part is marked RoHS non-compliant, meaning it contains lead (Pb) above the RoHS threshold. For EU-market products or any design governed by RoHS directives, this triggers an exemption claim — typically under exemption 7(c)-I for lead in electronic components. If your BOM requires full RoHS compliance, factor in the paperwork or look at the lead-free alternative suffix.
16-TSSOP — footprint and handling
The CY23S09ZC-1 comes in a 16-lead TSSOP package (0.173" body width, 4.40 mm) with a surface-mount footprint. The supplier device package is 16-TSSOP. This is a fine-pitch (0.65 mm typical) package that requires standard SMT assembly — no special process beyond what a typical reflow line handles. The package is rated for the commercial temperature range only.