Skip to main content
Infineon Technologies BTS50121EKAXUMA1 — Power Management (PMIC / Gate Driver)

Infineon BTS50121EKAXUMA1 PROFET, 10A High-Side Switch

MPNBTS50121EKAXUMA1
Active

Infineon Technologies PROFET™ smart high-side switch, BTS50121EKAXUMA1, 10A output, 12Ohm Rds(on), 5-28V load, 14-SOIC exposed pad, PG-DSO-14-43-EP.

$0.8100Ref. price · indicative, final on quote
Packaging14-SOIC (0.154", 3.90mm Width) Exposed Pad
SeriesPROFET™
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

BTS50121EKAXUMA1 specifications
ParameterValue
SeriesPROFET™
Input typeNon-Inverting
Output typeN-Channel
TypeGeneral Purpose
MountingSurface Mount
Voltage - load5V ~ 28V
Voltage - supply (Vcc (Vdd))Not Required
Output current10A
I/O channels1
InterfaceLogic
Operating temperature-40°C~150°C(TJ)
PackageBulk
FeaturesSlew Rate Controlled
Rds on12Ohm
Case14-SOIC (0.154\", 3.90mm Width) Exposed Pad
Fault protectionCurrent Limiting (Fixed), Over Temperature, Over Voltage, Short Circuit, UVLO
Output configurationHigh Side
Ratio - Input:Output1:1

Product details

Active production — what it means for the BOM line

The BTS50121EKAXUMA1: The part can be specified into new designs without lifecycle risk on the horizon.

10A high-side switch — load selection and fault protection

Rated for 10A continuous output with a typical on-resistance of 12 Ohm, the BTS50121EKAXUMA1 switches loads from 5V to 28V. The high-side N-channel configuration is the standard topology for automotive switched loads — lamps, solenoids, relays, small motors — where the load returns to chassis ground. The 12 Ohm Rds(on) at 10A produces about 1.2W conduction loss at full load — the exposed-pad 14-SOIC package is designed to sink that heat to the PCB copper. Fault protection covers the five most common failure modes: current limiting (fixed), over-temperature shutdown, over-voltage clamp, short-circuit protection, and under-voltage lockout. The slew-rate controlled output limits inrush current and reduces radiated EMI on long harness runs.

Package and thermal interface — PG-DSO-14-43-EP

The 14-SOIC package with exposed pad — Infineon's PG-DSO-14-43-EP — requires a thermal land on the PCB. The exposed paddle is the main heat path; a via array under the pad to an internal ground plane is standard practice for keeping junction temperature below 150°C at 10A continuous. Surface-mount assembly with standard SOIC reflow profiles. The exposed pad does not change the footprint pitch — 1.27 mm nominal — but the solder paste coverage under the paddle must be controlled to avoid voiding.

Frequently asked questions

What compliance documentation does Infineon provide for BTS50121EKAXUMA1?

The evidence does not list specific compliance documentation (RoHS, REACH, UL, IEC) for this order code. Infineon typically provides RoHS and REACH declarations for PROFET devices; confirm the specific certificate at quote time.