Package and mounting — PG-TSDSON-8-FL
Housed in an 8-PowerTDFN (PG-TSDSON-8-FL) surface-mount package, the BSZ065N06LS5ATMA1 is designed for automated assembly on standard PCB footprints. The supplier device package code PG-TSDSON-8-FL indicates a small-outline, no-lead package with an exposed drain pad for thermal management. The part is available in Tape & Reel (TR) and Cut Tape (CT) options for different production volumes.
It is ROHS3 compliant, meeting the latest EU restriction-of-hazardous-substances directive.