Package and thermal path — PG-TSDSON-8-FL
The power dissipation rating of 50 W at the case temperature tells the designer that the thermal interface — PCB copper area, vias, and heatsink if needed — is the limiting factor, not the silicon.

Infineon OptiMOS™ N-Channel MOSFET, 30V Vdss, 40A continuous drain at case, 2mOhm Rds(on) at 10V, PG-TSDSON-8-FL package, -55°C to 150°C junction temperature.
| Parameter | Value |
|---|---|
| Series | OptiMOS™ |
| FET type | N-Channel |
| Mounting | Surface Mount |
| Drain to source voltage | 30 V |
| Drive voltage (Max rds on, min rds on) | 4.5V, 10V |
| Current - continuous drain (Id) @ 25°C | 25A (Ta), 40A (Tc) |
| Power dissipation | 2.1W (Ta), 50W (Tc) |
| Operating temperature | -55°C ~ 150°C (TJ) |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Vgs | ±20V |
| Technology | MOSFET (Metal Oxide) |
| Case | 8-PowerTDFN |
| Vgs(th) (Max) @ id | 2V @ 250µA |
| Rds on (Max) @ id, vgs | 2mOhm @ 20A, 10V |
| Gate charge (Qg) (Max) @ vgs | 33 nC @ 10 V |
| Input capacitance (Ciss) (Max) @ vds | 2000 pF @ 15 V |
The power dissipation rating of 50 W at the case temperature tells the designer that the thermal interface — PCB copper area, vias, and heatsink if needed — is the limiting factor, not the silicon.
Designers and buyers need to identify compatible or substitute parts for BOM optimization or supply continuity.
Sourcing buyers need to find authorized distributors quickly to place orders and avoid counterfeit risks.
Lifecycle status affects long-term product availability and redesign decisions for production runs.
Volume pricing directly impacts BOM cost, a critical factor for procurement and margin planning.
Maintenance techs and buyers need drop-in replacement answers to avoid board redesign or rework.
PCB layout engineers need reliable pad dimensions for TSDSON-8 to ensure proper soldering and thermal performance.