Package and mounting
The BSP613PH6327XTSA1: The PG-SOT223-4 footprint is a standard four-lead surface-mount package with a large drain tab. The tab is the drain terminal, so the PCB copper pour under the part serves both electrical connection and thermal spreading. The 1.8 W power dissipation rating assumes the tab is soldered to a minimum recommended copper area; for continuous operation near the current limit, a larger copper plane or forced airflow may be needed.
Lifecycle and compliance
It is ROHS3 compliant, so it meets the current EU restriction on hazardous substances. The SIPMOS® series is Infineon's established trench MOSFET family, and the BSP613PH6327XTSA1 is the standard P-channel offering in the SOT223 package.
