BSP295H6327XTSA1

Infineon Technologies · SIPMOS® Series

Infineon SIPMOS® BSP295H6327XTSA1 N-channel MOSFET, 60 V drain-source, 1.8 A continuous drain, 300 mOhm Rds(on) at 10 V, SOT223-4 surface-mount package, -55°C to 150°C junction temperature.

Infineon Technologies BSP295H6327XTSA1
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

BSP295H6327XTSA1 specifications
Parameter / AttributeSpecification / Value
SeriesSIPMOS®
FET typeN-Channel
MountingSurface Mount
Drain to source voltage60 V
Drive voltage (Max rds on, min rds on)4.5V, 10V
Current - continuous drain (Id) @ 25°C1.8A (Ta)
Power dissipation1.8W (Ta)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-261-4, TO-261AA
Vgs(th) (Max) @ id1.8V @ 400µA
Rds on (Max) @ id, vgs300mOhm @ 1.8A, 10V
Gate charge (Qg) (Max) @ vgs17 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds368 pF @ 25 V

Technical details

60 V, 1.8 A N-channel MOSFET in SOT223-4

The Infineon BSP295H6327XTSA1 is a 60 V, 1.8 A N-channel enhancement-mode MOSFET from the SIPMOS® series, housed in a PG-SOT223-4 surface-mount package.

The gate threshold voltage is 1.8 V maximum at 400 µA drain current. The recommended drive voltage for minimum on-resistance is 10 V, but the part is characterised at both 4.5 V and 10 V.

Package, mounting, and thermal reality

The PG-SOT223-4 footprint is a four-lead surface-mount package with a large tab for heat transfer to the PCB copper. Maximum power dissipation is 1.8 W at 25°C ambient, derated to zero at 150°C junction.

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