Package and mounting — SOT-363 footprint
Housed in a PG-SOT363-PO (6-pin SOT-363) surface-mount package, the BSD235NH6327XTSA1 shares the same 2.0mm × 2.1mm footprint as other SOT-363 dual MOSFETs. The two channels share a common source pin, so verify your PCB layout accommodates the pinout before committing the BOM. The package is rated for 500mW total power dissipation — that is the sum of both channels, so if you run both at 450mA each, you are near the thermal limit without good copper flooding on the drain pads.
Infineon has not issued a discontinuation notice for this part, so it remains a standard catalog item through franchised distribution.
