What this 30 V N-channel MOSFET is for
It handles a continuous drain current of 13 A at the board level (Ta) and 45 A when the case is properly heatsunk (Tc), so the real-world limit depends on your PCB copper and airflow. The 9 mOhm on-resistance at 30 A and 10 V gate drive keeps conduction losses low enough that a 2.5 W board-level dissipation budget is realistic — but that 28 W case-rated maximum tells you the package can deliver if you pull the heat out through the PG-TDSON-8-6 footprint.
That pad is the main thermal path — you need a copper plane and vias under it to get the 28 W case-rated dissipation. The footprint is hand-solderable with a hot-air station if you're prototyping, but for production, reflow with a proper solder-paste stencil is the way to go. The ±20 V maximum gate-source voltage gives you margin against gate spikes in half-bridge configurations.