Package and mounting — PG-TSDSON-8
The BSC882N03MSG comes in a PG-TSDSON-8 package — Infineon's SuperSO8, a 5x6 mm² footprint with an exposed drain pad. The surface-mount assembly is standard reflow, but the large pad demands a stencil aperture sized for adequate solder volume — too little and the thermal resistance climbs, too much and you risk bridging the drain to the source pins. The 8-PowerTDFN package code is the JEDEC-equivalent descriptor; the supplier device code PG-TSDSON-8 is what Infineon prints on the reel label.
Thermal and electrical limits for the BOM
The 2.5 W dissipation at ambient is the bare-board limit; the 69 W at case temperature is what you get with a proper heatsink or PCB thermal vias.
