Package and mounting — TDSON-8 footprint
The BSC067N06LS3GATMA1: The supplier device package is PG-TDSON-8-5, an 8-lead PowerTDFN with an exposed pad for thermal dissipation. Surface-mount only; the exposed drain pad must be soldered to a copper plane on the PCB to achieve the 69 W power dissipation at case temperature. The 2.5 W derating in still air at ambient temperature is a reminder that this part relies on board-level heatsinking — a multi-layer board with thermal vias under the pad is expected for any continuous load above a few amps.
Lifecycle and compliance — active, ROHS3, no obsolescence signal
The BSC067N06LS3GATMA1 carries an active lifecycle status from Infineon and is ROHS3 compliant. No last-time-buy or end-of-life notices are on record for this order code.
