The 8-PowerTDFN package is a surface-mount, leadless design with an exposed pad. Power dissipation is rated at 2.5 W at ambient and 83 W at the case. The supplier device package code PG-TDSON-8-1 matches Infineon's standard footprint; verify the land pattern in the datasheet before layout.
For new designs or production BOMs, the active status means no immediate supply risk, but always confirm current availability at quote time through independent distribution.
