Package and thermal management
The 8-PowerTDFN package is a surface-mount, leadless design with an exposed pad. Power dissipation is rated at 2.5 W at ambient and 83 W at the case. For sustained 50 A loads, the PCB copper area and thermal vias under the pad must be sized to keep the junction below 150°C. The supplier device package code PG-TDSON-8-1 matches Infineon's standard footprint; verify the land pattern in the datasheet before layout.
Lifecycle and compliance
This part is listed as Active with ROHS3 compliance. No last-time-buy or end-of-life notice is on record. For new designs or production BOMs, the active status means no immediate supply risk, but always confirm current availability at quote time through independent distribution.
