Package and mounting — PG-TDSON-8-7
The BSC050N10NS5ATMA1: Housed in an 8-PowerTDFN (supplier package PG-TDSON-8-7), this is a surface-mount power package with an exposed drain pad on the bottom. The pad must be soldered to a thermal land on the PCB — the datasheet's recommended footprint and via pattern are what determine the effective Rth(j-c). The 3 W (Ta) / 136 W (Tc) power dissipation split tells you: at ambient, the board is the heatsink; at case-referenced, you need a thermal interface to a heatsink or chassis.
Lifecycle and compliance — active, no LTB watch
The BSC050N10NS5ATMA1 carries an Active lifecycle status and is ROHS3 compliant. No NRND or last-time-buy notices are on record for this order code.
