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Infineon Technologies BSC027N04LSGATMA1

Infineon BSC027N04LSGATMA1 N-Channel MOSFET, 40 V, 100 A

MPNBSC027N04LSGATMA1
End of Life

Infineon OptiMOS BSC027N04LSGATMA1, N-channel MOSFET, 40 V drain-source voltage, 100 A continuous drain at case temperature, 2.7 mOhm max on-resistance at 50 A, 10 V gate drive, PG-TDSON-8-1 package, -55°C to 150°C junction temperature.

$1.52Ref. price · indicative, final on quote
Infineon Technologies BSC027N04LSGATMA1 datasheet (PDF)
Packaging8-PowerTDFN
RoHSROHS3 Compliant
SeriesOptiMOS™
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

BSC027N04LSGATMA1 specifications
ParameterValue
SeriesOptiMOS™
FET typeN-Channel
MountingSurface Mount
Drain to source voltage40 V
Drive voltage (Max rds on, min rds on)4.5V, 10V
Current - continuous drain (Id) @ 25°C24A (Ta), 100A (Tc)
Power dissipation2.5W (Ta), 83W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
Case8-PowerTDFN
Vgs(th) (Max) @ id2V @ 49µA
Rds on (Max) @ id, vgs2.7mOhm @ 50A, 10V
Gate charge (Qg) (Max) @ vgs85 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds6800 pF @ 20 V

Product details

The Infineon BSC027N04LSGATMA1 is an OptiMOS N-channel MOSFET rated for 40 V drain-source voltage and a continuous drain current of 100 A at the case temperature, with a maximum on-resistance of 2.7 mOhm at 50 A and 10 V gate drive. The 83 W package limit at Tc can handle the dissipation with adequate heatsinking. The 24 A rating at ambient temperature (Ta) is the board-limited, no-heatsink ceiling. Gate charge is 85 nC at 10 V. A gate driver capable of sourcing and sinking a few amps will keep switching losses manageable. If the design drives the gate at 4.5 V instead of 10 V, expect the on-resistance to rise above the 2.7 mOhm minimum.

Package and mounting — PG-TDSON-8-1

The part comes in an 8-PowerTDFN package, supplier device code PG-TDSON-8-1, which is a surface-mount, dual-side-cooled package. The exposed drain pad on the bottom requires a thermal via pattern on the PCB to transfer heat to the ground plane.

Frequently asked questions

What is the datasheet for BSC027N04LSGATMA1?

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Is BSC027N04LSGATMA1 equivalent to BSC028N04LS?

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What is the pinout of BSC027N04LSGATMA1?

Critical for PCB layout and ensuring correct connections in the circuit.

Is BSC027N04LSGATMA1 obsolete?

Lifecycle status determines long-term availability for production and maintenance.