Package and mounting
The BSC010N04LS6ATMA1: Housed in the PG-TDSON-8-6 package — an 8-pin PowerTDFN with a large exposed pad for thermal transfer to the PCB. Surface-mount only; no through-hole option. The exposed pad needs a thermal via array under it to pull heat into the board plane. Orientation is marked by pin 1 indicator, but the symmetrical pad layout means you want to confirm the footprint before the reflow run.
Lifecycle and compliance
The BSC010N04LS6ATMA1 is listed as Active with ROHS3 compliance. No last-time-buy or end-of-life notice. For a BOM freeze, this part is stable — no imminent PCN risk from the manufacturer. The ROHS3 status covers the full substance restriction list, so it passes EU and China RoHS requirements without an exemption.
