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Infineon Technologies BFP520FH6327

BFP520FH6327 NPN RF Transistor, 45 GHz fT, 22.5 dB Gain

MPNBFP520FH6327
End of Life

Infineon BFP520FH6327 low-noise Si NPN RF transistor, 45 GHz fT, 22.5 dB gain, 0.95 dB NF at 1.8 GHz, 2.5 V Vceo, 50 mA Ic, 4-TSFP surface-mount package.

$0.15Ref. price · indicative, final on quote
Packaging4-SMD, Flat Leads
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
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Specifications

BFP520FH6327 Technical Specifications
ParameterValue
Mounting typeSurface Mount
FET typeNPN
Voltage - collector emitter breakdown2.5V
Current - collector (Ic)50mA
DC current gain (hFE) (Min) @ ic, vce70 @ 20mA, 2V
Power - max120mW
Frequency45GHz
Operating temperature150°C (TJ)
Gain22.5dB
PackageBulk
Case4-SMD, Flat Leads
Noise figure (dB typ @ f)0.95dB @ 1.8GHz

Product details

Low-noise Si NPN for receiver front-ends up to C-band

The Infineon BFP520FH6327 is a low-noise silicon NPN bipolar RF transistor designed for small-signal amplification in wireless receiver front-ends, LNA stages, and oscillator buffer chains up to several gigahertz. Its 45 GHz transition frequency (fT) and 22.5 dB gain at 1.8 GHz make it a fit for GSM, WCDMA, LTE, and ISM-band LNA designs where noise figure and gain flatness drive the cascade budget.

Noise figure and gain at 1.8 GHz — the LNA benchmark

Noise figure is specified at 0.95 dB typical at 1.8 GHz, a common reference for cellular and ISM-band LNA evaluation. The 22.5 dB gain at that same frequency means a single stage can lift a -100 dBm signal to a level the mixer or ADC can resolve without a second gain block, provided the collector supply is held at or below 2.5 V. At 50 mA maximum collector current, the part is sized for low-to-medium current LNA and driver stages, not power amplification.

Package and thermal handling for the 4-TSFP

The 4-TSFP package (4-SMD with flat leads) is a small outline with a low parasitic footprint suited to RF layouts up to 45 GHz. The junction temperature rating of 150 °C and 120 mW maximum power dissipation mean the part can run warm in a dense RF section, but the thermal path relies on the PCB copper — no exposed pad. Keep the collector pad connected to a ground plane via short vias to pull heat out of the die.

Frequently asked questions

What is the gain and noise figure of BFP520FH6327 at 1.8 GHz?

Gain is 22.5 dB and noise figure is 0.95 dB typical at 1.8 GHz, making it a strong candidate for a single-stage LNA in cellular or ISM-band receivers.