Supplied in a D2PAK (TO-263) surface-mount package, the AUIRLZ24NSTRL is intended for reflow soldering onto a PCB with adequate copper area for heat spreading.
No last-time-buy or obsolescence risk is associated with this order code at present.

Infineon AUIRLZ24NSTRL, HEXFET® series, N-Channel Power MOSFET, 55 V Vds, 18 A switching current, 60 mOhm Rds(on) max at 11 A / 10 V, D2PAK surface mount, -55°C to 175°C Tj.
| Parameter | Value |
|---|---|
| Series | HEXFET® |
| FET type | N-Channel |
| Mounting | Surface Mount |
| Operating temperature high | -55°C to 175°C(TJ) |
| Vgs | ±16 V |
| Power | 3.8 |
| Package_type | Bulk |
| Capacitance_uf | 0.0005 |
| Status | Active |
| Supply voltage | 55.0 |
| Vgs(Th) (Max) @ id | 2 V @ 250µA |
| Switching current | 18.0 |
| Rds on (Max) @ id, vgs | 60mOhm @ 11 A, 10 V |
| Gate charge (Qg) (Max) @ vgs | 15 nC @ 5 V |
Supplied in a D2PAK (TO-263) surface-mount package, the AUIRLZ24NSTRL is intended for reflow soldering onto a PCB with adequate copper area for heat spreading.
No last-time-buy or obsolescence risk is associated with this order code at present.
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