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Infineon Technologies AUIRFS8405TRL — Discrete Semiconductors

AUIRFS8405TRL MOSFET N-CH 40V 120A D2PAK, 2.3mOhm Rds(on)

MPNAUIRFS8405TRL
Active

Infineon HEXFET AUIRFS8405TRL, N-channel MOSFET, 40 V drain-source, 120 A continuous drain current, 2.3 mOhm max Rds(on) at 10 V, D2PAK surface-mount package, -55 to 175 °C junction temperature.

$1.25Ref. price · indicative, final on quote
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MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
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Specifications

AUIRFS8405TRL Technical Specifications
ParameterValue
SeriesHEXFET®
FET typeN-Channel
Mounting_typeSurface Mount
Operating temperature high-55°C to 175°C(TJ)
Vgs±20 V
Power_w163.0
Package_typeBulk
Capacitance_uf0.0052
Product_statusActive
Supply_voltage_v40.0
Vgs(Th) (Max) @ id3.9 V @ 100µA
Switching_current_a120.0
Rds on (Max) @ id, vgs2.3mOhm @ 100 A, 10 V
Gate charge (Qg) (Max) @ vgs161 nC @ 10 V

Product details

2.3 mOhm Rds(on) at 10 V — the conduction loss floor

The AUIRFS8405TRL is an Infineon HEXFET N-channel MOSFET rated for 40 V drain-source breakdown and 120 A continuous drain current. The headline spec is the 2.3 mOhm maximum on-resistance at Vgs=10 V and Id=100 A — that is the conduction loss floor at 25 °C junction temperature. In a 100 A load, the conduction loss sits at 23 W, well within the 163 W power dissipation rating of the D2PAK package when properly heatsunk.

Gate charge and switching loss budget

Total gate charge is 161 nC at Vgs=10 V. That is a substantial charge — the gate driver must source and sink that charge each switching cycle. At 100 kHz switching frequency, the average gate-drive current is 16.1 mA; the driver's peak current capability and the gate-loop inductance determine the turn-on and turn-off times. Plan the gate-drive circuit for at least 2 A peak to keep switching edges clean and avoid Miller-plateau dwell.

Junction temperature range and thermal design

The D2PAK (TO-263) package has an exposed drain tab on the top — the thermal pad on the PCB must be sized to the application's power dissipation. At 163 W maximum dissipation, a multi-layer board with thermal vias under the tab is the baseline; a heatsink on the tab further drops the junction-to-ambient thermal resistance.

Lifecycle and sourcing

No official replacement or second-source alternate is listed; the part is the current production variant in the HEXFET 40 V family.

Frequently asked questions

Is AUIRFS8405TRL obsolete?

No — the product status is listed as active.