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GigaDevice Semiconductor (HK) Limited — Memory (DRAM / SRAM / Flash / EEPROM)

GigaDevice Semiconductor (HK) Limited Memory (DRAM / SRAM / Flash / EEPROM) — 14 part numbers with specifications and datasheets. Filter by key specs and request a

Base Product Number
GD25Q127 · GD25Q128 · GD25Q16 · GD25Q20
Supplier Device Package
24-TFBGA (6x8) · 16-SOP · 8-SOP · 8-WSON (5x6)
Memory Organization
16M x 8 · 2M x 8 · 256K x 8 · 32M x 8
Memory Size
128Mbit · 16Mbit · 2Mbit · 256Mbit
Package / Case
24-TBGA · 16-SOIC (0.295", 7.50mm Width) · 8-SOIC (0.209", 5.30mm Width) · 8-WDFN Exposed Pad
Operating Temperature
-40°C~85°C(TA) · -40°C~105°C(TA) · -40°C ~ 105°C (TA) · -40°C ~ 85°C (TA)
Package
Tray · Tube · Tape & Reel (TR); Cut Tape (CT) · Tape & Reel (TR)
Write Cycle Time - Word, Page
12µs, 2.4ms · 70µs, 2.4ms · 50µs, 2.4ms · 70µs, 2ms

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