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Analog Devices MAX8511EXK33-T — Analog & Data Acquisition

MAX8511EXK33-T LDO Regulator, 3.3V Fixed, 120mA, SC-70-5

MPNMAX8511EXK33-T
End of Life

Analog Devices MAX8511EXK33-T LDO linear regulator, 3.3V fixed output, 120mA output current, 90µA quiescent current, SC-70-5 surface-mount package, industrial temperature range.

$0.68Ref. price · indicative, final on quote
Packaging5-TSSOP, SC-70-5, SOT-353
RoHSRoHS non-compliant
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MAX8511EXK33-T specifications
ParameterValue
Output typeFixed
MountingSurface Mount
Voltage - input6V
Voltage dropout0.12V @ 120mA (Typ)
Voltage - output (Min (Fixed))3.3V
Output current120mA
Current - quiescent90 µA
Operating temperature-40°C ~ 85°C (TA)
PSRR72dB ~ 46dB (1kHz ~ 100kHz)
PackageBulk
Case5-TSSOP, SC-70-5, SOT-353
Control featuresShutdown
Protection featuresOver Current, Over Temperature
Number of regulators1
Output configurationPositive

Product details

3.3V fixed LDO with 72dB PSRR at 1kHz

The MAX8511EXK33-T: Its 90µA quiescent current suits battery-powered or always-on loads where standby draw matters. Power-supply rejection ratio (PSRR) is 72dB at 1kHz, rolling off to 46dB at 100kHz — enough to clean up ripple from a switching preregulator feeding sensitive analog circuitry.

Dropout and protection at operating temperature

Maximum dropout voltage is 0.12V at the full 120mA load, typical — the headroom between input and 3.3V output must stay above this across the load range to maintain regulation. On-chip protection includes over-current and over-temperature shutdown, covering the output against sustained shorts or thermal runaway. The shutdown control feature lets a system microcontroller gate the output for sequenced power-up.

SC-70-5 package and board-fit

Housed in a 5-lead SC-70-5 (SOT-353) package — 2.0mm × 2.1mm footprint with 0.65mm pin pitch. The small body suits space-constrained layouts on multi-layer PCBs where the decoupling caps sit close to the input and output pins. Surface-mount assembly with standard reflow profiles; no exposed thermal pad, so the junction-to-ambient thermal resistance relies on the copper plane area under the package.