Package and board-fit — through-hole 8-DIP
Housed in an 8-DIP (0.300", 7.62mm) package with a through-hole mount, the MAX709REPA is hand-solderable and breadboard-friendly — no hot-air profile needed, and it fits standard 0.1-inch pitch prototyping grids.
Compliance and sourcing note
This part is marked RoHS non-compliant per the manufacturer's listing — verify your board's material declaration requirements before committing the BOM line.
