It packs 256 KB of Flash and 96 KB of SRAM into a 16-pin wafer-level package (WLP) measuring 1.55 x 1.57 mm — roughly the footprint of a grain of rice.
96 MHz Cortex-M4F — what the speed buys you
96 MHz on a Cortex-M4F with single-cycle MAC and FPU means you can run a 3rd-order IIR filter or a PID loop with floating-point coefficients without bit-shifting or lookup tables.
Rated for -40°C to 105°C ambient, this MCU operates from a 1.71 V to 3.63 V supply.
Package reality: 16-WLP assembly considerations
The 16-WLP (1.55 x 1.57 mm) is a wafer-level chip-scale package with solder balls on the bottom — no leads, no plastic overmold. That means the PCB land pattern must match the ball pitch exactly, and reflow profile needs to follow the JEDEC standard for WLP. No lab, no bench: if you are swapping this on site, you will need a hot-air rework station with a fine nozzle and a steady hand.