The MAX20087ATPA/VY+ is a quad-channel current-switch IC designed to protect camera modules in automotive vision systems — each channel delivers up to 600 mA from a 3 V to 15 V input rail, with ±8% accuracy on the current-limit threshold. The 20-TQFN-EP (4x4 mm) package with wettable flank terminals supports automated optical inspection (AOI) after reflow — a requirement for automotive-grade solder-joint reliability in high-volume assembly.
Package and board-fit for rework and inspection
Housed in a 20-WFQFN with exposed pad (4x4 mm body), the MAX20087ATPA/VY+ uses a wettable-flank terminal finish — the side of each QFN pad is plated so the solder fillet climbs up the edge, giving AOI a clear visual pass/fail on joint wetting. The exposed pad under the package draws heat during rework — preheat the board to 125°C before hot-air removal to avoid lifting the pad. Supplied in tray format, which means the parts arrive in a rigid carrier with individual cavities — no tape-and-reel handling, so the leads stay undamaged and the moisture-barrier bag is easier to reseal for partial-batch use.
Active lifecycle and compliance posture
No minimum order threshold beyond the tray quantity.