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Analog Devices MAX1819EBL33+T — Microcontrollers & Processors (MCU / MPU / DSP)

MAX1819EBL33+T LDO Regulator, 500 mA, 3.3 V Fixed, UCSP

MPNMAX1819EBL33+T
End of Life

Analog Devices MAX1819EBL33+T LDO voltage regulator, 500 mA output, 3.3 V fixed, 0.232 V dropout, 6-UCSP (1.52x1.52 mm), Tape & Reel.

$1.81346Ref. price · indicative, final on quote
Packaging6-UFBGA, CSPBGA
RoHSROHS3 Compliant
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MAX1819EBL33+T specifications
ParameterValue
Output typeAdjustable (Fixed)
MountingSurface Mount
Voltage - input5.5V
Voltage dropout0.232V @ 500mA
Voltage - output5V
Voltage - output (Min (Fixed))1.25V (3.3V)
Output current500mA
Current - quiescent250 µA
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR)
Case6-UFBGA, CSPBGA
Control featuresEnable, Power Good
Protection featuresOver Current, Over Temperature, Short Circuit
Number of regulators1
Output configurationPositive

Product details

The MAX1819EBL33+T is a single-output positive LDO from Analog Devices, delivering 500 mA with a fixed 3.3 V output (adjustable option also available). Maximum dropout is 0.232 V at the full 500 mA load, meaning the input rail needs to stay at least that margin above 3.3 V to maintain regulation. With a 5.5 V input maximum, this LDO works cleanly off a 3.6 V Li-ion cell or a 5 V USB rail.

Quiescent current and protection for battery duty

Quiescent current is 250 µA typical, which is moderate for a 500 mA LDO — not the lowest in class, but acceptable for always-on peripherals in battery gear where the load current dominates the power budget. The Enable and Power Good control features let the system power down the regulator when the rail is not needed, cutting Iq to near zero. Built-in protection covers overcurrent, overtemperature, and short-circuit conditions, so the regulator can survive a momentary output short without external foldback circuitry.

Package and board integration

The 6-UCSP (1.52 x 1.52 mm) package is a wafer-level chip-scale package with solder bumps directly on the die. The 0.5 mm pitch and small footprint require careful PCB layout — the land pattern must match the supplier device package recommendation exactly, and the board stack-up should keep the thermal path through the bumps to the PCB copper. Store the reels dry: UCSP packages are moisture-sensitive and need dry-bag storage per J-STD-033. Tape & Reel packaging (TR) means the parts come on a carrier tape for automated pick-and-place assembly. The reel quantity is the standard for this package size — confirm the reel count against your build volume when requesting a quote.