MAX14761ETB+T

Analog Devices

Analog Devices MAX14761ETB+T SPST-NO/NC analog switch, dual 2:1 mux, 2 Ohm on-resistance, -83dB crosstalk at 100kHz, 10-TDFN (3x3) package, Tape & Reel.

Analog Devices MAX14761ETB+T
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

MAX14761ETB+T specifications
Parameter / AttributeSpecification / Value
MountingSurface Mount
Voltage - supply, single (V+)3V ~ 5.5V
Current - leakage (IS(off))250nA
Operating temperature-40°C ~ 85°C (TA)
-3db bandwidth100MHz
PackageTape & Reel (TR); Cut Tape (CT)
Crosstalk-83dB @ 100kHz
Case10-WFDFN Exposed Pad
Switch circuitSPST - NO/NC
Charge injection1370pC
Number of circuits2
On-State resistance2Ohm
Switch time (Ton, toff)300µs, 1ns
Multiplexer (Demultiplexer circuit)1:1
Channel-to-Channel matching (ΔRon)5.1mOhm

Technical details

Dual SPST switch with low on-resistance and high isolation

The MAX14761ETB+T is a dual 1:1 multiplexer/demultiplexer from Analog Devices, configured as two independent SPST switches — one normally-open, one normally-closed per the SPST - NO/NC topology. Each switch carries a maximum on-resistance of 2 Ohm, with channel-to-channel matching held to 5.1 mOhm, so the insertion loss across the two paths tracks tightly in a differential signal chain. The -3 dB bandwidth is 100 MHz, and crosstalk between channels is -83 dB at 100 kHz — this combination suits the part for routing audio or low-speed data signals where isolation between adjacent paths matters more than raw switching speed.

Signal integrity and parametric boundaries

Maximum switch times are 300 µs for turn-on and 1 ns for turn-off — the asymmetric timing means the off-to-on transition is the bottleneck for multiplexing applications; the fast turn-off prevents glitch feedthrough when the control signal drops. Charge injection is 1370 pC, a figure to budget for in sample-and-hold or precision integrator front-ends where the injected charge appears as a step on the hold capacitor. Off-state leakage is 250 nA max at 25 °C — in a high-impedance node this leakage current multiplied by the source impedance produces an offset error that may dominate the signal chain budget.

Package, footprint, and temperature grade

The 3x3 mm body with 0.50 mm pitch is a common DFN footprint; the stencil aperture for the centre pad should be segmented to avoid solder voiding during reflow. Surface-mount only; the Tape & Reel (TR) and Cut Tape (CT) options suit both prototype and production volumes.

Lifecycle and compliance posture

Analog Devices lists the MAX14761ETB+T as Active (current production) and ROHS3 Compliant.

MAX14761ETB+T
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