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Analog Devices DS28EA00U+T&R — Discrete Semiconductors

DS28EA00U+T&R Digital Temperature Sensor, ±0.5°C Accuracy

MPNDS28EA00U+T&R
End of Life

Analog Devices DS28EA00U+T&R digital, local temperature sensor, 11 b resolution, 1-Wire® output, ±0.5°C accuracy, 3V ~ 5.5V supply, -40°C ~ 85°C, 8-uMAX/uSOP package, Tape & Reel.

$8.41Ref. price · indicative, final on quote
Packaging8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

DS28EA00U+T&R specifications
ParameterValue
Output type1-Wire®
Sensor typeDigital, Local
MountingSurface Mount
Supply voltage3V ~ 5.5V
Operating temperature-40°C ~ 85°C
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesOutput Switch, Programmable Limit, Programmable Resolution
Resolution11 b
Case8-TSSOP, 8-MSOP (0.118\", 3.00mm Width)
Test condition-10°C ~ 85°C (<-10°C)
Accuracy - highest (Lowest)±0.5°C (-0.5°C, 2°C)
Sensing temperature - local-40°C ~ 85°C

Product details

The rated accuracy is ±0.5°C over the -10°C to 85°C range, with a wider spread of -0.5°C / +2°C below -10°C. That ±0.5°C figure is the one a calibration tech cares about — it tells you whether this sensor can hold a process temperature within a tight band without a field trim. For a freezer alarm or a server-room monitor, that's plenty. For a precision oven or a medical incubator, you'll want to check whether the -0.5°C / +2°C tail below -10°C matters for your low-end setpoint.

Housed in an 8-uMAX/uSOP package (3.00 mm width, surface-mount), it's a small footprint for dense PCB layouts. The Tape & Reel variant (DS28EA00U+T&R) is what you'd order for automated pick-and-place.

Frequently asked questions

Does DS28EA00U+T&R work with 3.3V?

Yes, the 3V to 5.5V supply range includes 3.3V. The 1-Wire bus runs at the same voltage as the supply, so a 3.3V host works directly.

Can DS28EA00U+T&R replace DS28EA00 without code changes?

The DS28EA00U+T&R is the Tape & Reel variant of the DS28EA00. The die and firmware interface are identical — no code changes needed. The only difference is the packaging format for automated assembly.