Maxim Integrated DeepCover® series, DS28E25P+ Authentication Chip, Surface Mount, 6-SMD J-Lead (6-TSOC), Tray.
| Parameter | Value |
|---|---|
| Type | Authentication Chip |
| Series | DeepCover® |
| Mounting | Surface Mount |
| Package | Tray |
| Applications | Authentication, Security |
| Case | 6-SMD, J-Lead |
The Maxim Integrated DS28E25P+ is a DeepCover® series authentication chip for security and anti-cloning applications. It is housed in a 6-TSOC package for surface-mount assembly.
The 6-TSOC package uses J-bend leads standard for reflow soldering. Verify the land pattern against the package drawing before committing the PCB layout.
The DeepCover series is Maxim's security-focused platform, and this part carries no known PCN risk at this time.
The DS28E25P+ is the same device as the DS28E25 in a different package variant (6-TSOC J-Lead). The base authentication chip function and interface are identical. The 'P+' suffix indicates the 6-TSOC package option. They are functionally compatible but not footprint-identical — verify the land pattern before substitution.
The DS28E25P+ is an authentication chip used for secure challenge-response authentication in applications such as accessory/consumable verification, system clone prevention, and secure device identity. Typical environments include medical disposables, IoT nodes, industrial sensors, and consumer electronics where a tamper-resistant identity is needed.