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Analog Devices AD8137WYCPZ-R7 — Memory (DRAM / SRAM / Flash / EEPROM)

AD8137WYCPZ-R7 Analog Devices Differential Op-Amp, 110 MHz

MPNAD8137WYCPZ-R7
End of Life

Analog Devices Automotive series differential amplifier, AD8137WYCPZ-R7, single circuit, 110 MHz -3dB bandwidth, 450 V/µs slew rate, rail-to-rail differential output, 8-LFCSP (3x3) package, Tape & Reel.

$4.02Ref. price · indicative, final on quote
Packaging8-WFDFN Exposed Pad, CSP
RoHSROHS3 Compliant
SeriesAutomotive
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

AD8137WYCPZ-R7 specifications
ParameterValue
SeriesAutomotive
Output typeDifferential, Rail-to-Rail
MountingSurface Mount
Amplifier typeDifferential
Voltage - input offset700 µV
Voltage - supply span2.7 V
Current - supply3.2mA
Current - input bias500 nA
Current - output (Channel)20 mA
Operating temperature-40°C ~ 125°C
-3db bandwidth110 MHz
PackageTape & Reel (TR); Cut Tape (CT)
Slew rate450V/µs
Case8-WFDFN Exposed Pad, CSP
Number of circuits1

Product details

110 MHz differential driver for ADC front-ends

The AD8137WYCPZ-R7 is a single-circuit differential amplifier from Analog Devices' Automotive series, built to drive high-speed ADCs in engine-control and chassis-domain signal chains. Its 110 MHz -3dB bandwidth and 450 V/µs slew rate mean the output settles within 0.1% in under 10 ns for a 2 V step — fast enough to keep the ADC sampling aperture jitter from dominating the SNR at 10 MSPS and above.

Package footprint and layout constraints

The 0.5 mm pitch lands are solder-mask-defined — the stencil aperture should be 1:1 with the pad to avoid bridging on the fine-pitch inner rows. The Tape & Reel packaging (7-inch reel, 3000 pieces) is the standard for automated pick-and-place; the Cut Tape option suits prototype builds where the full reel quantity is not needed.

Frequently asked questions

What is the closest functional alternative to AD8137WYCPZ-R7?

The AD8137YRZ-REEL shares the same 110 MHz bandwidth, 450 V/µs slew rate, and differential rail-to-rail output topology but comes in an 8-lead SOIC package instead of the 3x3 LFCSP. The SOIC footprint is larger, so a board layout change is required for the swap — the electrical performance is otherwise identical.