Logic density and I/O budget
The XC7S50-1FGGA484C packs 52,160 logic cells in 4,075 CLB slices — enough for a soft-core processor, a few DSP pipelines, and glue logic without filling the fabric. The 250 user I/O break out to the 484-ball BGA, giving you roughly half the balls as signal pins; the rest are power and ground for the 0.95V–1.05V core and the I/O banks. On-chip block RAM totals 2,764,800 bits — about 337 KB. That is enough for a moderate packet buffer or a couple of frame lines at 720p, but anything larger needs the external memory controller built from the fabric.
484-ball FPBGA, 23×23 mm body, 1.0 mm ball pitch. Surface-mount only; the BGA footprint demands a multi-layer PCB with via-in-pad or microvia fan-out for the inner rows.
Lifecycle and compliance
ROHS3 compliant — no exemptions beyond the standard ten substance restrictions. The base product number is XC7S50; the suffix -1FGGA484C encodes the speed grade (-1, the slowest), the package (FGGA484), and the temperature range (C for commercial).