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AMD XC7S25-L1FTGB196I — FPGA / CPLD & Programmable Logic

AMD XC7S25-L1FTGB196I Spartan-7 FPGA, 23360 LEs, 100 I/O

MPNXC7S25-L1FTGB196I
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AMD Spartan®-7 FPGA, XC7S25-L1FTGB196I, 23360 logic cells, 1658880 RAM bits, 100 I/O, 196-CSBGA, -40°C to 100°C, Tray.

$47.3900Ref. price · indicative, final on quote
Packaging196-LBGA, CSPBGA
RoHSROHS3 Compliant
SeriesSpartan®-7
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

XC7S25-L1FTGB196I specifications
ParameterValue
SeriesSpartan®-7
MountingSurface Mount
Supply voltage0.92V ~ 0.98V
Operating temperature-40°C ~ 100°C (TJ)
PackageTray
Number of i (O)100
Case196-LBGA, CSPBGA
Total RAM bits1658880
Number of LABs (CLBs)1825
Number of logic elements (Cells)23360

Product details

What 23,360 logic cells and 1.6 Mbit block RAM mean for a motor-drive control loop

The XC7S25-L1FTGB196I packs 23,360 logic elements and 1,658,880 total RAM bits in a Spartan-7 fabric — enough headroom to run a dual-axis servo position loop with a S-curve profile and still leave logic for encoder decoding and fault handling. The block RAM holds the look-up tables for the commutation angle, so the core doesn't stall fetching from external memory each cycle. With 100 user I/O, this 196-CSBGA (15x15 mm) part can interface to parallel ADCs on the current-sense bus, a quadrature encoder interface, and a SPI flash for configuration — all without multiplexing the pins. The 0.92 V to 0.98 V core supply keeps dynamic power under 1 W typical at full utilisation, which matters when the FPGA sits next to a hot IGBT module on the same board.

Industrial temperature grade and active lifecycle — what a repair bench needs to know

The 0.92 V to 0.98 V supply rail is tight; a 3% regulator holds it within spec across the temperature range. No last-time-buy or NRND flags — it's still a valid choice for new designs. Sourced through independent distribution; availability and current pricing confirmed at RFQ. The scorch mark on a dead board tells you which rail failed, not the FPGA itself — this part usually survives unless the core supply overshoots.

Package and board-fit for the rework bench

The 196-CSBGA (15x15 mm) package has a 0.80 mm ball pitch — standard for a 4-layer PCB with via-in-pad. The exposed paddle on the underside needs a thermal via array to the ground plane; without it the junction-to-board thermal resistance climbs and the 100°C limit gets tighter.

Frequently asked questions

What is the closest pin-compatible alternative to XC7S25-L1FTGB196I?

The XC7S25-L1FTGB196I is part of the Spartan-7 family. The base product number XC7S25 indicates the logic density tier; a pin-compatible sibling within the same 196-CSBGA package would share the same footprint and I/O count.

What compliance documentation does AMD provide for this FPGA?

The XC7S25-L1FTGB196I is ROHS3 compliant. AMD provides the standard RoHS declaration and material composition data for the Spartan-7 series.